Company Invensas Corporation, owned by Tessera Technologies, has developed an interesting chip. It is a memory chip in a complex in XFD technology that combines all the memory chips in a typical SO-DIMM memory module for notebook in one solution.
XFD technology is a multilayer chip in a BGA package - currently possible solutions with two (Dual Face Down - DFD) or four levels (Quad Face Down - QFD). Invensasovo solution supports x4, x8 and x16 bus widths and speeds up to 2133 MHz, but the technology is still in development so that they can expect a better performance in the final product.
The company is among the first beneficiaries of this solution see the servers and data centers, but the outlook is for use in laptops, where space, power consumption and heat relevant characteristics. The technology could double or quadruple the total amount of memory on the DIMM module, a demonstration is expected next week at the Intel Developer Forum in San Francisco.